Developed and marketed by Syfer in 2001, FlexiCap flexible termination has been on PC boards for tens of thousands of operating hours. No other flexible termination on the market has a track record as long as Syfer's. An estimated 99% of all ceramic chip failures are due to mechanical flex. FlexiCap is applied to the device under the standard nickel barrier finish to accommodate a greater degree of board bending than conventional capacitors, virtually eliminating mechanical flex cracking problems. FlexiCap is RoHS-compliant and compatible with both leaded and lead-free solder processes. This unique technology was also awarded the Queens award for innovation.