Molex's ultra-fit tangless connector wire-to-board system offers a 3.50 mm pitch, a high current rating of 14.0 A, and superior design options for flexibility and efficient assembly. Color-coded housings mitigate the risk of mismating. Optional TPA retainers significantly reduce terminal backout. A streamlined design that is 17% smaller than competing power connectors provides space savings, and an ultra-low mating force reduces operator fatigue when mating numerous high-circuit connectors.