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TMS5703137DPGEQQ1

TMS5703137DPGEQQ1
Mfr. #:
TMS5703137DPGEQQ1
描述:
ARM Microcontrollers - MCU Gladiator F021
生命周期:
制造商新产品。
数据表:
TMS5703137DPGEQQ1 数据表
交货:
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ECAD Model:
更多信息:
TMS5703137DPGEQQ1 更多信息 TMS5703137DPGEQQ1 Product Details
产品属性
属性值
制造商：
德州仪器
产品分类：
ARM 微控制器 - MCU
RoHS：
Y
安装方式：
贴片/贴片
包装/案例：
LQFP-144
系列：
TMS570LS3137
核：
ARM Cortex R4F
数据总线宽度：
32 bit/16 bit
最大时钟频率：
160 MHz
程序内存大小：
3072 kB
数据内存大小：
256 kB
ADC分辨率：
12 bit
I/O 数量：
58 I/O
工作电源电压：
1.2 V
最低工作温度：
- 40 C
最高工作温度：
+ 125 C
资质：
AEC-Q100
产品：
单片机
程序存储器类型：
闪光
品牌：
德州仪器
数据内存类型：
内存
数据ROM大小：
64 kB
数据ROM类型：
电可擦可编程只读存储器
接口类型：
CAN, I2C, SCI/LIN, SPI
模拟电源电压：
3 V to 5.25 V
输入/输出电压：
3.3 V
湿气敏感：
是的
ADC 通道数：
24 Channel
产品类别：
ARM 微控制器 - MCU
出厂包装数量：
60
子类别：
微控制器 - MCU
电源电压 - 最大值：
1.32 V
电源电压 - 最小值：
1.14 V
看门狗定时器：
看门狗定时器
单位重量：
0.045652 oz
Tags
TMS5703137, TMS5703, TMS570, TMS57, TMS5, TMS
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***as Instruments
16/32 Bit RISC Flash MCU, Arm Cortex-R4F, EMAC, FlexRay 144-LQFP -40 to 125
***et Europe
MCU 16-Bit/32-Bit Hercules TMS570 ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 144-Pin LQFP
***ical
MCU 16-bit/32-bit ARM Cortex R4F RISC 3MB Flash 1.2V/3.3V Automotive 144-Pin LQFP
***i-Key
IC MCU 32BIT 3MB FLASH 144LQFP
***ark
Gladiator F021
***AS USD
The TMS570LS3137 device is a high-performance automotive-grade microcontroller family for safety systems. The safety architecture includes dual CPUs in lockstep, CPU and memory BIST logic, ECC on both the flash and the data SRAM, parity on peripheral memories, and loopback capability on peripheral I/Os.
***ASIN
The TMS570LS3137 device integrates the ARM Cortex-R4F Floating-Point CPU. The CPU offers an efficient 1.66 DMIPS/MHz, and has configurations that can run up to 180 MHz, providing up to 298 DMIPS. The device supports the word-invariant big-endian [BE32] format.
***AS INSTRU
The TMS570LS3137 device has 3MB of integrated flash and 256KB of data RAM. Both the flash and RAM have single-bit error correction and double-bit error detection. The flash memory on this device is a nonvolatile, electrically erasable, and programmable memory implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (same level as I/O supply) for all read, program, and erase operations. When in pipeline mode, the flash operates with a system clock frequency of up to 180 MHz. The SRAM supports single-cycle read and write accesses in byte, halfword, word, and double-word modes.
***AS USD
The TMS570LS3137 device features peripherals for real-time control-based applications, including two Next Generation High-End Timer (N2HET) timing coprocessors and two 12-bit Analog-to-Digital Converters (ADCs) supporting up to 24 inputs.
***AS INSTR
The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs, capture or compare inputs, or GPIO. The N2HET is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. A High-End Timer Transfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HTU.
***XS
The device has two 12-bit-resolution MibADCs with 24 channels and 64 words of parity-protected buffer RAM each. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. Sixteen channels are shared between the two MibADCs. There are three separate groupings. Each sequence can be converted once when triggered or configured for continuous conversion mode. The MibADC has a 10-bit mode for use when compatibility with older devices or faster conversion time is desired.
***AS INS
The device has multiple communication interfaces: three MibSPIs, two SPIs, one LIN, one SCI, three DCANs, one I2C module, one Ethernet, and one FlexRay controller. The SPIs provide a convenient method of serial high-speed communication between similar shift-register type devices. The LIN supports the Local Interconnect standard 2.0 and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format.
***AS INSTRU
The DCAN supports the CAN 2.0 (A and B) protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. The DCAN is ideal for systems operating in noisy and harsh environments (for example, automotive vehicle networking and industrial fieldbus) that require reliable serial communication or multiplexed wiring.
***TEXAS
The FlexRay controller uses a dual-channel serial, fixed time base multimaster communication protocol with communication rates of 10 Mbps per channel. A FlexRay Transfer Unit (FTU) enables autonomous transfers of FlexRay data to and from the CPU main memory. Transfers are protected by a dedicated, built-in MPU. The Ethernet module supports MII, RMII, and MDIO interfaces.
***as Instruments (TI)
The I2C module is a multimaster communication module providing an interface between the microcontroller and an I2C-compatible device through the I2C serial bus. The I2C supports speeds of 100 and 400 Kbps.
***
The Frequency-Modulated Phase-Locked Loop (FMPLL) clock module is used to multiply the external frequency reference to a higher frequency for internal use. There are two FMPLL modules on this device. These modules, when enabled, provide two of the seven possible clock source inputs to the Global Clock Module (GCM). The GCM manages the mapping between the available clock sources and the device clock domains.
***AS INS
The device also has an External Clock Prescaler (ECP) module that when enabled, outputs a continuous external clock on the ECLK pin (or ball). The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of the device operating frequency.
***AS INSRUMENT
The DMA controller has 16 channels, 32 control packets, and parity protection on its memory. An MPU is built into the DMA to limit the DMA to prescribed areas of memory and to protect the rest of the memory system from any malfunction of the DMA.
***
The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt is generated or the external ERROR pin is toggled when a fault is detected. The ERROR pin can be monitored externally as an indicator of a fault condition in the microcontroller.
***AS INSRUMENTS
The External Memory Interface (EMIF) provides off-chip expansion capability with the ability to interface to synchronous DRAM (SDRAM) devices, asynchronous memories, peripherals or FPGA devices.
***AS INSTRU
Several interfaces are implemented to enhance the debugging capabilities of application code. In addition to the built-in ARM Cortex-R4F CoreSight debug features, an External Trace Macrocell (ETM) provides instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port (RTP) module is implemented to support high-speed tracing of RAM and peripheral accesses by the CPU or any other master. A Data Modification Module (DMM) gives the ability to write external data into the device memory. Both the RTP and DMM have no or only minimum impact on the program execution time of the application code. A Parameter Overlay Module (POM) can reroute flash accesses to internal memory or to the EMIF. This rerouting allows the dynamic calibration against production code of parameters and tables without rebuilding the code to explicitly access RAM or halting the processor to reprogram the data flash.
***AS INSTRUM
With integrated safety features and a wide choice of communication and control peripherals, the TMS570LS3137 device is an ideal solution for high-performance real-time control applications with safety-critical requirements.
Processors
OMO Electronic Processors provide a comprehensive portfolio, proven software, and worldwide support enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.
TMS570LS3137 RISC Flash Microcontrollers
OMO Electronic TMS570LS3137 16/32-Bit RISC Flash Microcontrollers provide safety architecture in a high-performance automotive-grade microcontroller designed for safety systems. The safety architecture incorporates ECC on both the flash and the data SRAM, CPU and memory BIST logic, parity on peripheral memories, loop-back capability on peripheral I/Os, and dual CPUs in lockstep. The TMS570LS3137 integrates the ARM Cortex-R4F Floating-Point CPU, which utilizes an efficient 1.66DMIPS/MHz. The CPU provides up to 298 DMIPS through the use of configurations that can run up to 180MHz. 3MB of integrated flash, along with 256KB of data RAM offer single-bit error correction and double-bit error detection on the device. Other features include a variety of communication interfaces three MibSPIs, two SPIs, one LIN, one SCI, three DCANs, one I2C module, one Ethernet, and one FlexRay controller.
型号 描述 库存 价格
TMS5703137DPGEQQ1
DISTI # V39:1801_07405625		MCU 16-bit/32-bit ARM Cortex R4F RISC 3MB Flash 1.2V/3.3V Automotive 144-Pin LQFP
RoHS: Compliant		58
  • 9000:$21.4700
  • 6000:$21.5000
  • 3000:$21.5200
  • 60:$25.6500
TMS5703137DPGEQQ1
DISTI # 296-42452-ND		IC MCU 32BIT 3MB FLASH 144LQFP
RoHS: Compliant
Min Qty: 1
Container: Tray		2580In Stock
  • 120:$24.6574
  • 60:$27.5773
  • 10:$28.8750
  • 1:$31.3100
TMS5703137DPGEQQ1
DISTI # 29064468		MCU 16-bit/32-bit ARM Cortex R4F RISC 3MB Flash 1.2V/3.3V Automotive 144-Pin LQFP
RoHS: Compliant		116
  • 58:$25.6500
TMS5703137DPGEQQ1
DISTI # TMS5703137DPGEQQ1		MCU 16-Bit/32-Bit Hercules TMS570 ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 144-Pin LQFP (Alt: TMS5703137DPGEQQ1)
RoHS: Compliant
Min Qty: 60		Europe - 360
  • 60:€25.7900
  • 120:€23.2900
  • 240:€21.1900
  • 360:€20.3900
  • 600:€19.4900
TMS5703137DPGEQQ1
DISTI # TMS5703137DPGEQQ1		MCU 16-Bit/32-Bit Hercules TMS570 ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 144-Pin LQFP - Trays (Alt: TMS5703137DPGEQQ1)
RoHS: Compliant
Min Qty: 60
Container: Tray		Americas - 0
  • 60:$26.9900
  • 120:$26.3900
  • 240:$25.2900
  • 360:$24.6900
  • 600:$24.2900
TMS5703137DPGEQQ116/32 Bit RISC Flash MCU, Arm Cortex-R4F, EMAC, FlexRay1324
  • 1000:$18.4300
  • 750:$18.4900
  • 500:$20.6000
  • 250:$21.9000
  • 100:$22.0600
  • 25:$24.8200
  • 10:$25.6300
  • 1:$27.4200
TMS5703137DPGEQQ1
DISTI # 595-MS5703137DPGEQQ1		ARM Microcontrollers - MCU 16- and 32-Bit RISC Flash Microcontroller 144-LQFP -40 to 125
RoHS: Compliant		328
  • 1:$31.3100
  • 5:$30.0200
  • 10:$28.8800
  • 25:$27.5800
  • 100:$24.6600
  • 250:$23.5300
TMS5703137DPGEQQ1
DISTI # XSKDRABV0029125		 
RoHS: Compliant		60
  • 60:$46.2500
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可用性
库存:
162
订购:
2145
输入数量:
TMS5703137DPGEQQ1的当前价格仅供参考，如果您想获得最优惠的价格，请提交查询或直接发送电子邮件至我们的销售团队[email protected]
参考价格（美元）
数量
单价
小计金额
1
US$31.31
US$31.31
5
US$30.02
US$150.10
10
US$28.88
US$288.80
25
US$27.58
US$689.50
100
US$24.66
US$2 466.00
250
US$23.53
US$5 882.50
500
US$22.39
US$11 195.00
由于2021年半导体供不应求，低于2021年之前的正常价格，请发询价确认。
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