SD9SB8W-512G-1122

Mfr. #:: SD9SB8W-512G-1122
制造商:: SanDisk
描述:: Solid State Drives - SSD 512GB 2.5in SATA Client SSD
生命周期:: 制造商新产品。
数据表:: SD9SB8W-512G-1122 数据表
交货:: DHL FedEx Ups TNT EMS
支付:: T/T Paypal Visa MoneyGram Western Union
ECAD Model:
更多信息:: SD9SB8W-512G-1122 更多信息

产品属性
属性值

制造商：: 闪迪

产品分类：: 固态硬盘 - SSD

RoHS：: Y

系列：: X600

内存大小：: 512 GB

产品：: SATA 闪存盘

构成因素：: 2.5 in

配置：: SLC、薄层色谱

最低工作温度：: 0 C

最高工作温度：: + 70 C

方面：: 7 mm x 69.85 mm x 100.2 mm

持续写入：: 530 MB/s

持续阅读：: 560 MB/s

品牌：: 闪迪

接口类型：: SATA 6Gbps

产品类别：: 固态硬盘 - SSD

出厂包装数量：: 50

子类别：: 内存和数据存储

Tags: SD9SB, SD9S, SD9

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

SD9SB8W-512G-1122 评级和评论

V***o

Thank you very much to the seller! Ordered 18.03.2019 received 04.05.2019 city of rostov-on-don. Checked a few pieces all right. I recommend this seller!

2019-05-05

T***M

Delivery on average. Quality is visually good. In the case did not use. I recommend

2019-06-25

SD9SB8W-512G-1122 更多信息

X600 3D NAND SATA SSD: SanDisk® X600 3D NAND SATA Solid State Drives (SSD) are designed based on Western Digital 64-layer 3D NAND. These SSDs includes nCache™ 2.0, a tiered caching technology designed to improve responsiveness for corporate and consumer workloads. The nCache 2.0 uses a combination of both Single Level Cell (SLC) and Triple Level Cell (TLC) flash blocks. The X600 SSDs consume 25% less power compared to the previous generations of SATA SSDs. These SSDs are optimized for the demanding power management requirements of ultra-thin and small form factor products.

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