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66AK2E05XABDA4

66AK2E05XABDA4
Mfr. #:
66AK2E05XABDA4
描述:
Digital Signal Processors & Controllers - DSP, DSC Edison 2 ARM, 4 DSP, 1.4Ghz ext temp
生命周期:
制造商新产品。
数据表:
66AK2E05XABDA4 数据表
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更多信息:
66AK2E05XABDA4 更多信息 66AK2E05XABDA4 Product Details
产品属性
属性值
制造商：
德州仪器
产品分类：
数字信号处理器和控制器 - DSP、DSC
RoHS：
E
安装方式：
贴片/贴片
包装/案例：
FCBGA-532
系列：
TMS320C6414
产品：
DSP
最大时钟频率：
500 MHz
程序内存大小：
128 kB
工作电源电压：
1.2 V
最低工作温度：
0 C
最高工作温度：
+ 90 C
打包：
托盘
程序存储器类型：
异步SRAM、同步SDRAM、SBSRAM
品牌：
德州仪器
I/O 数量：
16 I/O
数据总线宽度：
32 bit
教学类型：
固定点
湿气敏感：
是的
产品类别：
DSP - 数字信号处理器和控制器
出厂包装数量：
60
子类别：
嵌入式处理器和控制器
商品名：
TMS320
单位重量：
0.110457 oz
Tags
66AK2E05, 66AK2E, 66AK2, 66AK, 66A
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***as Instruments
Multicore DSP+Arm, 4x Arm A15 cores, 1x C66x DSP core, NetCP, 10GbE switch 1089-FCBGA -40 to 100
***ical
DSP Fixed-Point/Floating-Point 32bit 1.4GHz 1089-Pin FCBGA Tray
***et
Multicore DSP+ARM KeyStone II System-on-Chip (SoC)
***ark
Edison 2 ARM, 4 DSP, 1.4Ghz ext temp
***AS INSTRUMEN
The 66AK2E0x is a high performance device based on TI’s KeyStone II Multicore SoC Architecture, incorporating the most performance-optimized Cortex-A15 processor single-core or quad-core CorePac and C66x DSP core, that can run at a core speed of up to 1.4 GHz. TI’s 66AK2E0x device enables a high performance, power-efficient and easy to use platform for developers of a broad range of applications such as enterprise grade networking end equipment, data center networking, avionics and defense, medical imaging, test and automation.
***AS INSTRUMENTS INCORPORATED
TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (for example, ARM CorePac (Cortex-A15 Processor Quad Core CorePac), C66x CorePac, network processing, and uses a queue-based communication system that allows the device resources to operate efficiently and seamlessly. This unique device architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to high-speed IO, to each operate at maximum efficiency with no blocking or stalling.
***AS INST
TI’s C66x core launches a new era of DSP technology by combining fixed-point and floating point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). It can execute 8 single precision floating point MAC operations per cycle and can perform double- and mixed-precision operations and is IEEE754 compliant. For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64×+ cores. The C66x CorePac incorporates 90 new instructions targeted for floating point and vector math oriented processing. These enhancements yield sizeable performance improvements in popular DSP kernels used in signal processing, mathematical, and image acquisition functions. The C66x core is backwards code compatible with TI'’s previous generation C6000 fixed and floating point DSP cores, ensuring software portability and shortened software development cycles for applications migrating to faster hardware.
***AS USD
The 66AK2E0x KeyStone II device integrates a large amount of on-chip memory. The Cortex-A15 processor cores each have 32KB of L1Data and 32KB of L1 Instruction cache. The up to four Cortex A15 cores in the ARM CorePac share a 4MB L2 Cache. In the DSP CorePac, in addition to 32KB of L1 program and 32KB of L1 data cache, there is 512KB of dedicated memory per core that can be configured as cache or as memory mapped RAM. The device also integrates 2MB of Multicore Shared Memory (MSMC) that can be used as a shared L3 SRAM. All L2 and MSMC memories incorporate error detection and error correction. For fast access to external memory, this device includes a 64-bit DDR-3 (72-bit with ECC support) external memory interface (EMIF) running at 1600 MTPS.
***AS INSTR
The device enables developers to use a variety of development and debugging tools that include GNU GCC, GDB, Open source Linux, Eclipse based debugging environment enabling kernel and user space debugging using a variety of Eclipse plug-ins including TI's industry leading IDE Code Composer Studio.
Processors
OMO Electronic Processors provide a comprehensive portfolio, proven software, and worldwide support enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.
66AK2E05 Multicore DSP+ARM Keystone II SoC
OMO Electronic 66AK2E05 Multicore DSP+ARM Keystone II System on Chip (SoC) is a high-performance device with multicore SoC architecture. This SoC features quad-core ARM Cortex-A15 processors, 2MB of Multicore Shared Memory Controller (MSMC), and TMS320C66x DSP core subsystem. The 66AK2E05 SoC integrates a large amount of on-chip memory and includes a 64bit DDR3 external memory interface. This Keystone II SoC enables to use a variety of development and debugging tools including open source Linux debugging environment. The ideal end equipment includes CT scanner, embedded PC, network attached storage, oscilloscope, X-ray, and ethernet switch. The 66AK2E05 offers 0°C to 85°C of the commercial case temperature and -40°C to 100°C of extended case temperature. Typical applications include consumer electronics, medical, security, space, communication, avionics, and defense.
型号 描述 库存 价格
66AK2E05XABDA4
DISTI # V39:1801_07213438		DSP Fixed-Point/Floating-Point 32bit 1.4GHz 1089-Pin FCBGA9
  • 5000:$175.0500
  • 2000:$176.8500
  • 1000:$178.6500
  • 40:$180.4500
66AK2E05XABDA4
DISTI # 66AK2E05XABDA4-ND		IC DSP ARM SOC
RoHS: Compliant
Min Qty: 40
Container: Tray		Temporarily Out of Stock
  • 40:$178.3810
66AK2E05XABDA4
DISTI # 31021479		DSP Fixed-Point/Floating-Point 32bit 1.4GHz 1089-Pin FCBGA9
  • 9:$180.4500
66AK2E05XABDA4
DISTI # 66AK2E05XABDA4		Multicore DSP+ARM KeyStone II System-on-Chip (SoC) (Alt: 66AK2E05XABDA4)
RoHS: Compliant
Min Qty: 1		Europe - 0
  • 1:€174.5900
  • 10:€172.2900
  • 25:€170.1900
  • 50:€167.9900
  • 100:€165.9900
  • 500:€163.9900
  • 1000:€161.9900
图片 型号 描述
TMDSEMU560V2STM-UE

Mfr.#: TMDSEMU560V2STM-UE

OMO.#: OMO-TMDSEMU560V2STM-UE

 Emulators / Simulators XDS560 Class High Speed Emulators
TMDSEMU200-U

Mfr.#: TMDSEMU200-U

OMO.#: OMO-TMDSEMU200-U-TEXAS-INSTRUMENTS

 XDS200 USB JTAG EMULATOR
TMDSEMU560V2STM-U

Mfr.#: TMDSEMU560V2STM-U

OMO.#: OMO-TMDSEMU560V2STM-U-TEXAS-INSTRUMENTS

 EMULATOR TRACE SYSTEM USB
TMDSEMU560V2STM-UE

Mfr.#: TMDSEMU560V2STM-UE

OMO.#: OMO-TMDSEMU560V2STM-UE-TEXAS-INSTRUMENTS

 EMULATOR TRACE SYSTEM XDS560
可用性
库存:
Available
订购:
4500
输入数量:
66AK2E05XABDA4的当前价格仅供参考，如果您想获得最优惠的价格，请提交查询或直接发送电子邮件至我们的销售团队[email protected]
参考价格（美元）
数量
单价
小计金额
1
US$190.45
US$190.45
5
US$187.77
US$938.85
10
US$182.40
US$1 824.00
25
US$181.08
US$4 527.00
50
US$181.07
US$9 053.50
由于2021年半导体供不应求，低于2021年之前的正常价格，请发询价确认。
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