669-33ABT3

669-33ABT3
Mfr. #:
669-33ABT3
制造商:
Wakefield-Vette
描述:
Heat Sinks SpeedClip Heat Sink Assembly for Intel IDX4, AMD; 17x17 SPGA
生命周期:
制造商新产品。
数据表:
669-33ABT3 数据表
交货:
DHL FedEx Ups TNT EMS
支付:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
669-33ABT3 Datasheet
ECAD Model:
产品属性
属性值
制造商:
韦克菲尔德-维特
产品分类:
散热片
品牌:
韦克菲尔德-维特
产品类别:
散热片
子类别:
散热片
Tags
669-3, 669
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***er Electronics
BOARD LEVEL HEAT SINK - SPEEDCLIP HEAT SINK ASSEMBLY FOR INTEL IDX4, AMD; 17X17 SPGA
***i-Key
HEATSINK ASSY FOR SPGA
***hardson RFPD
BOARD LEVEL HEAT SINK
图片 型号 描述
669-33ABT3

Mfr.#: 669-33ABT3

OMO.#: OMO-669-33ABT3

Heat Sinks SpeedClip Heat Sink Assembly for Intel IDX4, AMD; 17x17 SPGA
669-3-R100KD

Mfr.#: 669-3-R100KD

OMO.#: OMO-669-3-R100KD-1190

全新原装
可用性
库存:
Available
订购:
5500
输入数量:
669-33ABT3的当前价格仅供参考,如果您想获得最优惠的价格,请提交查询或直接发送电子邮件至我们的销售团队[email protected]
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