EP2C15AF256C8N

Mfr. #:: EP2C15AF256C8N
制造商:: Intel
描述:: IC FPGA 152 I/O 256FBGA Cyclone II
生命周期:: 制造商新产品。
数据表:: EP2C15AF256C8N 数据表
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更多信息:: EP2C15AF256C8N 更多信息

产品属性
属性值

制造商: 阿尔特拉

产品分类: 嵌入式 - FPGA（现场可编程门阵列）

系列: 旋风R II

产品: 旋风二号

打包: 托盘

安装方式: 贴片/贴片

商品名: 旋风二号

包装盒: FBGA-256

工作温度: 0°C ~ 85°C (TJ)

安装型: 表面贴装

电压供应: 1.15 V ~ 1.25 V

供应商-设备-包: 256-FBGA (17x17)

门数: -

IO数量: 152

LABs-CLBs 的数量: 903

逻辑单元数: 14448

总 RAM 位: 239616

最高工作温度: + 70 C

最低工作温度: 0 C

工作电源电压: 1.15 V to 1.25 V

最大工作频率: 260 MHz

I-O 数: 152 I/O

逻辑阵列块数-LAB: 903

逻辑元素数: 14448

总内存: 239616 bit

Tags: EP2C15AF256C, EP2C15AF2, EP2C1, EP2C, EP2

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

EP2C15AF256C8N 描述

***et Europe: FPGA Cyclone® II Family 14448 Cells 402.58MHz 90nm Technology 1.2V 256-Pin FBGA

***nell: FPGA, CYCLONE II, 15K ELEMENTS, FBGA256

***ark: ; Logic Type:EP2C15A; Logic Base Number:2; No. of I/O Pins:152; Termination Type:SMD; Package/Case:256-FBGA; No. of Pins:256; IC Generic Number:; Operating Temp. Max:85°C; Operating Temp. Min:0°C ;RoHS Compliant: Yes

EP2C15AF256C8N 更多信息

Cyclone® Family FPGAs: Intel Cyclone® Family FPGAs are built to meet your low-power, cost-sensitive design needs, enabling you to get to market faster. Each generation of Cyclone FPGAs solves the technical challenges of increased integration, increased performance, lower power, and faster time to market while meeting cost-sensitive requirements. Intel Cyclone V FPGAs provide the market's lowest system cost and lowest power FPGA solution for applications in the industrial, wireless, wireline, broadcast, and consumer markets. The family integrates an abundance of hard intellectual property (IP) blocks to enable you to do more with less overall system cost and design time. The SoC FPGAs in the Cyclone V family offer unique innovations such as a hard processor system (HPS) centered around the dual-core ARM® Cortex™-A9 MPCore™ processor with a rich set of hard peripherals to reduce system power, system cost, and board size. Intel Cyclone IV FPGAs are the lowest cost, lowest power FPGAs, now with a transceiver variant. The Cyclone IV FPGA family targets high volume, cost-sensitive applications, enabling you to meet increasing bandwidth requirements while lowering costs. Intel Cyclone III FPGAs offer an unprecedented combination of low cost, high functionality, and power optimization to maximize your competitive edge. The Cyclone III FPGA family is manufactured using Taiwan Semiconductor Manufacturing Company's low-power process technology to deliver low power consumption at a price that rivals that of ASICs. Intel Cyclone II FPGAs are built from the ground up for low cost and to provide a customer-defined feature set for high volume, cost-sensitive applications. Intel Cyclone II FPGAs deliver high performance and low power consumption at a cost that rivals that of ASICs.Learn More

Cyclone® II FPGAs: Altera Cyclone® II 90nm FPGAs are built from the ground up for the low cost and to provide a customer-defined feature set for high volume, cost-sensitive applications. Cyclone II FPGAs deliver high-performance and low-power consumption at a cost that rivals that of ASICs. Cyclone II FPGAs extend the low-cost FPGA density range to 68,416 Logic Elements (LEs) and provide up to 622 usable I/O pins and up to 1.1Mbits of embedded memory. These FPGAs are manufactured on 300mm wafers using TSMC's 90nm low-k dielectric process to ensure rapid availability and low cost. By minimizing silicon area, Cyclone II devices can support complex digital systems on a single chip at a cost that rivals that of ASICs. Altera Cyclone II FPGAs offer 60% higher performance and half the power consumption of competing 90nm FPGAs. The low cost and optimized feature set of Cyclone II FPGAs make them ideal solutions for a wide array of automotive, consumer, communications, video processing, test and measurement, and other end-market solutions.

Market price

型号	制造商	描述	库存	价格
EP2C15AF256C8N DISTI # 544-2098-ND	Intel Corporation	IC FPGA 152 I/O 256FBGA RoHS: Compliant Min Qty: 1 Container: Tray	184In Stock	1:$39.9000
EP2C15AF256C8N DISTI # 989-EP2C15AF256C8N	Intel Corporation	FPGA - Field Programmable Gate Array FPGA - Cyclone II 903 LABs 152 IOs RoHS: Compliant	54	1:$39.9000
EP2C15AF256C8N	Altera Corporation		0
EP2C15AF256C8N	Intel Corporation	CYCLONE II DEVICE FAMILY LEAD FREE, FBGA-256 RoHS: Compliant	Europe - 3

图片	型号	描述
	Mfr.#: EP2C15AF484I8N OMO.#: OMO-EP2C15AF484I8N	FPGA - Field Programmable Gate Array FPGA - Cyclone II 903 LABs 315 IOs
	Mfr.#: EP2C15AF484C6N OMO.#: OMO-EP2C15AF484C6N	FPGA - Field Programmable Gate Array FPGA - Cyclone II 903 LABs 315 IOs
	Mfr.#: EP2C15AF256C6N OMO.#: OMO-EP2C15AF256C6N	FPGA - Field Programmable Gate Array FPGA - Cyclone II 903 LABs 152 IOs
	Mfr.#: EP2C15AF256C8N OMO.#: OMO-EP2C15AF256C8N	FPGA - Field Programmable Gate Array FPGA - Cyclone II 903 LABs 152 IOs
	Mfr.#: EP2C15AF256C7N OMO.#: OMO-EP2C15AF256C7N	FPGA - Field Programmable Gate Array FPGA - Cyclone II 903 LABs 152 IOs
	Mfr.#: EP2C15AF484A7N OMO.#: OMO-EP2C15AF484A7N	FPGA - Field Programmable Gate Array FPGA - Cyclone II 903 LABs 315 IOs
	Mfr.#: EP2C15AF256C7N OMO.#: OMO-EP2C15AF256C7N-INTEL	IC FPGA 152 I/O 256FBGA Cyclone II
	Mfr.#: EP2C15AF484I8N OMO.#: OMO-EP2C15AF484I8N-INTEL	IC FPGA 315 I/O 484FBGA Cyclone II
	Mfr.#: EP2C15AF256I7N OMO.#: OMO-EP2C15AF256I7N-1190	全新原装
	Mfr.#: EP2C15AF484C6NES OMO.#: OMO-EP2C15AF484C6NES-1190	全新原装

EP2C15AF256C8N

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes