374724B00035G

Mfr. #:: 374724B00035G
制造商:: Aavid, Thermal Division of Boyd Corporation
描述:: Heat Sinks Heatsink for Plastic BGA Packages, Black Anodized, 35x35x18mm, IC Pkg Size = 35 x 35, Tape #35
生命周期:: 制造商新产品。
数据表:: 374724B00035G 数据表
交货:: DHL FedEx Ups TNT EMS
支付:: T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:: 374724B00035G Datasheet
ECAD Model:

产品属性
属性值

制造商：: 阿维德

产品分类：: 散热片

RoHS：: Y

产品：: 散热片

安装方式：: 粘合剂

鳍式：: 全向鳍

热阻：: 15.3 C/W

长度：: 35 mm

宽度：: 35 mm

高度：: 18 mm

专为：: BGA

颜色：: 黑色的

系列：: 3747

品牌：: 阿维德

产品类别：: 散热片

出厂包装数量：: 670

子类别：: 散热片

Tags: 374724B0, 374724, 37472, 3747, 374

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

374724B00035G 描述

***er Electronics: Heat Sinks Heatsink for Plastic BGA Packages, Black Anodized, 35x35x18mm, IC Pkg Size = 35 x 35, Tape #35

***et: Heat Sink, For Ball Grid Array, BGA, 15.3 °C/W, 18 mm, 35 mm, 35 mm

***ical: Heat Sink Passive BGA Pin Array Tape 15.3C/W Black Anodized

***i-Key: HEATSINK BGA 35X35X18MM W/ADH

***nell: HEAT SINK BGA 35 X 35 X 18 WITH PAD; IC - Transistor Case:BGA; Thermal Resistance:15.3°C/W; External Width:35mm; Height:18mm; External Height:18mm; Length:35mm; Mounting Type:Adhesive Mount; Package / Case:BGA

***ark: HEAT SINK; Thermal Resistance:15.3�C/W; Packages Cooled:BGA; External Width - Metric:35mm; External Height - Metric:18mm; External Length - Metric:35mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; Product Range:- RoHS Compliant: Yes

***ment14 APAC: HEAT SINK BGA 35 X 35 X 18 WITH PAD; Packages Cooled:BGA; Thermal Resistance:15.3°C/W; SVHC:No SVHC (20-Jun-2011); External Height:18mm; External Width:35mm; Height:18mm; Length:35mm; Mounting Type:Adhesive Mount; Package / Case:BGA; Width:35mm

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