EP3C16U484C8

Mfr. #:: EP3C16U484C8
制造商:: Intel
描述:: IC FPGA 346 I/O 484UBGA Cyclone III
生命周期:: 制造商新产品。
数据表:: EP3C16U484C8 数据表
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更多信息:: EP3C16U484C8 更多信息

产品属性
属性值

制造商: 阿尔特拉

产品分类: 嵌入式 - FPGA（现场可编程门阵列）

系列: 旋风R III

产品: 旋风III

打包: 托盘

安装方式: 贴片/贴片

商品名: 旋风III

包装盒: BGA-484

工作温度: 0°C ~ 85°C (TJ)

安装型: 表面贴装

电压供应: 1.15 V ~ 1.25 V

供应商-设备-包: 484-UBGA (19x19)

门数: -

IO数量: 346

LABs-CLBs 的数量: 963

逻辑单元数: 15408

总 RAM 位: 516096

最高工作温度: + 70 C

最低工作温度: 0 C

工作电源电压: 1.15 V to 1.25 V

最大工作频率: 315 MHz

I-O 数: 346 I/O

逻辑阵列块数-LAB: 963

逻辑元素数: 15408

总内存: 516096 bit

Tags: EP3C16U484C, EP3C16U4, EP3C16U, EP3C16, EP3C1, EP3C, EP3

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

EP3C16U484C8 描述

***et Europe: FPGA Cyclone® III Family 15408 Cells 402MHz 65nm Technology 1.2V 484-Pin UFBGA

***i-Key: IC CYCLONE III FPGA 484UBGA

***el Nordic: Contact for details

EP3C16U484C8 更多信息

Cyclone® III FPGAs: Altera Cyclone® III FPGAs offer an unprecedented combination of low power, high functionality, and low cost to maximize your competitive edge. The features and architecture of the Altera Cyclone III FPGA family provides the ideal solution for your high-volume, low-power, cost-sensitive applications. With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. To address your unique design needs, this FPGA family offers two variants: Cyclone III provides the lowest power and high functionality with the lowest cost. Cyclone III LS provides the lowest power FPGAs with security.Learn More

Cyclone® Family FPGAs: Intel Cyclone® Family FPGAs are built to meet your low-power, cost-sensitive design needs, enabling you to get to market faster. Each generation of Cyclone FPGAs solves the technical challenges of increased integration, increased performance, lower power, and faster time to market while meeting cost-sensitive requirements. Intel Cyclone V FPGAs provide the market's lowest system cost and lowest power FPGA solution for applications in the industrial, wireless, wireline, broadcast, and consumer markets. The family integrates an abundance of hard intellectual property (IP) blocks to enable you to do more with less overall system cost and design time. The SoC FPGAs in the Cyclone V family offer unique innovations such as a hard processor system (HPS) centered around the dual-core ARM® Cortex™-A9 MPCore™ processor with a rich set of hard peripherals to reduce system power, system cost, and board size. Intel Cyclone IV FPGAs are the lowest cost, lowest power FPGAs, now with a transceiver variant. The Cyclone IV FPGA family targets high volume, cost-sensitive applications, enabling you to meet increasing bandwidth requirements while lowering costs. Intel Cyclone III FPGAs offer an unprecedented combination of low cost, high functionality, and power optimization to maximize your competitive edge. The Cyclone III FPGA family is manufactured using Taiwan Semiconductor Manufacturing Company's low-power process technology to deliver low power consumption at a price that rivals that of ASICs. Intel Cyclone II FPGAs are built from the ground up for low cost and to provide a customer-defined feature set for high volume, cost-sensitive applications. Intel Cyclone II FPGAs deliver high performance and low power consumption at a cost that rivals that of ASICs.Learn More

Market price

型号	制造商	描述	库存	价格
EP3C16U484C8N DISTI # V36:1790_07395103	Intel Corporation	FPGA Cyclone® III Family 15408 Cells 402MHz 65nm Technology 1.2V 484-Pin UFBGA	0	1:$45.6200
EP3C16U484C8N DISTI # 544-2480-ND	Intel Corporation	IC FPGA 346 I/O 484UBGA Min Qty: 1 Container: Tray	422In Stock	1:$45.6200
EP3C16U484C8 DISTI # 544-2477-ND	Intel Corporation	IC FPGA 346 I/O 484UBGA Min Qty: 84 Container: Tray	Temporarily Out of Stock	84:$45.6204
EP3C16U484C8 DISTI # 989-EP3C16U484C8	Intel Corporation	FPGA - Field Programmable Gate Array FPGA - Cyclone III 963 LABs 346 IOs RoHS: Not compliant	0	1:$45.6200
EP3C16U484C8N DISTI # 989-EP3C16U484C8N	Intel Corporation	FPGA - Field Programmable Gate Array FPGA - Cyclone III 963 LABs 346 IOs RoHS: Compliant	43	1:$45.6200
EP3C16U484C8N DISTI # 1635065	Altera Corporation	FPGA, CYCLONE III, 16K LE, 484UBGA RoHS: Compliant	0	1:$93.4700

图片	型号	描述
	Mfr.#: EP3C16F256C6N OMO.#: OMO-EP3C16F256C6N	FPGA - Field Programmable Gate Array FPGA - Cyclone III 963 LABs 168 IOs
	Mfr.#: EP3C16E144A7N OMO.#: OMO-EP3C16E144A7N	FPGA - Field Programmable Gate Array FPGA - Cyclone III 963 LABs 84 IOs
	Mfr.#: EP3C16F484A7N OMO.#: OMO-EP3C16F484A7N	FPGA - Field Programmable Gate Array FPGA - Cyclone III 963 LABs 346 IOs
	Mfr.#: EP3C16U256C6 OMO.#: OMO-EP3C16U256C6-INTEL	IC FPGA 168 I/O 256UBGA Cyclone III
	Mfr.#: EP3C16U484C6 OMO.#: OMO-EP3C16U484C6-INTEL	IC FPGA 346 I/O 484UBGA Cyclone III
	Mfr.#: EP3C16Q240C8 OMO.#: OMO-EP3C16Q240C8-INTEL	FPGA - Field Programmable Gate Array FPGA - Cyclone III 963 LABs 160 IOs
	Mfr.#: EP3C16M164C7N OMO.#: OMO-EP3C16M164C7N-INTEL	IC FPGA 92 I/O 164MBGA Cyclone III
	Mfr.#: EP3C16E144A7N OMO.#: OMO-EP3C16E144A7N-INTEL	FPGA - Field Programmable Gate Array FPGA - Cyclone III 963 LABs 84 IOs
	Mfr.#: EP3C16F484C7N OMO.#: OMO-EP3C16F484C7N-INTEL	IC FPGA 346 I/O 484FBGA Cyclone III
	Mfr.#: EP3C16F484I7NGA OMO.#: OMO-EP3C16F484I7NGA-1190	EP3C16F484I7NGA^ALTERA

EP3C16U484C8

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes