OMAPL137DZKBT3

OMAPL137DZKBT3
Mfr. #:
OMAPL137DZKBT3
描述:
Digital Signal Processors & Controllers - DSP, DSC C6000 DSP+ARM Processor
生命周期:
制造商新产品。
数据表:
OMAPL137DZKBT3 数据表
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ECAD Model:
更多信息:
OMAPL137DZKBT3 更多信息 OMAPL137DZKBT3 Product Details
产品属性
属性值
制造商:
德州仪器
产品分类:
数字信号处理器和控制器 - DSP、DSC
RoHS:
Y
安装方式:
贴片/贴片
包装/案例:
BGA-256
系列:
OMAP-L137
产品:
DSP
核:
TMS320C674x, ARM926EJ-S
最大时钟频率:
375 MHz, 375 MHz
L1 高速缓存指令存储器:
32 kB, 16 kB
L1 高速缓存数据存储器:
32 kB, 16 kB
程序内存大小:
32 kB
数据内存大小:
8 kB
工作电源电压:
1.14 V to 1.32 V
最低工作温度:
- 40 C
最高工作温度:
+ 125 C
打包:
托盘
程序存储器类型:
缓存
品牌:
德州仪器
接口类型:
SPI、USB
数据总线宽度:
16 bit
开发套件:
TMDSOSKL137
教学类型:
定点/浮点
L2 缓存指令/数据存储器:
256 kB
湿气敏感:
是的
核心数:
2 Core
定时器/计数器的数量:
1 Timer
产品类别:
DSP - 数字信号处理器和控制器
出厂包装数量:
90
子类别:
嵌入式处理器和控制器
电源电压 - 最小值:
1.14 V
商品名:
OMAP 应用处理器
单位重量:
0.098203 oz
Tags
OMAPL137D, OMAPL137, OMAPL1, OMAPL, OMAP, OMA
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et Europe
MPU TMS320C6000 RISC 32-Bit 456MHz 1.8V/3.3V 256-Pin BGA
***as Instruments
C6747 DSP+Arm Processor 256-BGA -40 to 125
***ical
SOC OMAPL1xx ARM926EJ-S Automotive 256-Pin BGA Tray
***i-Key
IC MPU OMAP-L1X 375MHZ 256BGA
***ark
Primus 3.0 production
***AS INS
The OMAP-L137 device is a low-power applications processor based on an ARM926EJ-S and a TMS320C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000 platform of DSPs.
***AS INSRUMENTS
The OMAP-L137 device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.
***as Instruments (TI)
The dual-core architecture of the OMAP-L137 device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.
***AS INS
The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.
***
The ARM core has a coprocessor 15 (CP15), protection module, and data and program Memory Management Units (MMUs) with table look-aside buffers. The ARM core has separate 16-KB instruction and 16KB of data caches. Both memory blocks are four-way associative with virtual index virtual tag (VIVT). The ARM core also has 8KB of RAM (Vector Table) and 64KB of ROM.
***AS INSTUMENTS
The OMAP-L137 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32-KB direct mapped cache and the Level 1 data cache (L1D) is a 32-KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.
***AS INTRUMENTS
The peripheral set includes: a 10/100 Mbps Ethernet MAC (EMAC) with a management data input/output (MDIO) module; two I2C Bus interfaces; 3 multichannel audio serial ports (McASPs) with 16/12/4 serializers and FIFO buffers; two 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host-port interface (HPI); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with both RTS and CTS); three enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; two 32-bit enhanced quadrature encoded pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.
***as Instruments Inc.
The Ethernet Media Access Controller (EMAC) provides an efficient interface between the OMAP-L137 device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration.
***ASIN
The HPI, I2C, SPI, USB1.1, and USB2.0 ports allow the OMAP-L137 device to easily control peripheral devices and/or communicate with host processors.
***AS INSTRUMENTS INCORPORATED
The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.
***NS
The OMAP-L137 device has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.
Processors
OMO Electronic Processors provide a comprehensive portfolio, proven software, and worldwide support enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.
型号 描述 库存 价格
OMAPL137DZKBT3
DISTI # V36:1790_07303333
SOC OMAPL1xx ARM926EJ-S Automotive 256-Pin BGA
RoHS: Compliant
15
  • 91:$17.9933
  • 1:$18.6516
  • 90:$22.4400
OMAPL137DZKBT3
DISTI # 296-42786-ND
IC MPU OMAP-L1X 375MHZ 256BGA
RoHS: Compliant
Min Qty: 1
Container: Tray
1363In Stock
  • 180:$22.9535
  • 90:$25.6717
  • 10:$26.8800
  • 1:$29.1400
OMAPL137DZKBT3
DISTI # 31928224
SOC OMAPL1xx ARM926EJ-S Automotive 256-Pin BGA
RoHS: Compliant
15
  • 1:$22.4400
OMAPL137DZKBT3
DISTI # OMAPL137DZKBT3
MPU TMS320C6000 RISC 32-Bit 456MHz 1.8V/3.3V 256-Pin BGA - Trays (Alt: OMAPL137DZKBT3)
RoHS: Compliant
Min Qty: 90
Container: Tray
Americas - 0
  • 90:$25.1900
  • 180:$24.4900
  • 360:$23.5900
  • 540:$22.9900
  • 900:$22.5900
OMAPL137DZKBT3
DISTI # OMAPL137DZKBT3
MPU TMS320C6000 RISC 32-Bit 456MHz 1.8V/3.3V 256-Pin BGA (Alt: OMAPL137DZKBT3)
RoHS: Compliant
Min Qty: 90
Asia - 0
    OMAPL137DZKBT3C6000 DSP+ARM Processor1800
    • 1000:$17.1600
    • 750:$17.2200
    • 500:$19.1800
    • 250:$20.3900
    • 100:$20.5400
    • 25:$23.1100
    • 10:$23.8600
    • 1:$25.5200
    OMAPL137DZKBT3
    DISTI # 595-OMAPL137DZKBT3
    Digital Signal Processors & Controllers - DSP, DSC C6000 DSP+ARM Processor
    RoHS: Compliant
    149
    • 1:$29.1500
    • 5:$27.9400
    • 10:$26.8800
    • 25:$25.6800
    • 100:$22.9600
    • 250:$21.9000
    XOMAPL137DZKBT3
    DISTI # N/A
    Digital Signal Processors & Controllers - DSP, DSC Primus 3.00
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      可用性
      库存:
      149
      订购:
      2132
      输入数量:
      OMAPL137DZKBT3的当前价格仅供参考,如果您想获得最优惠的价格,请提交查询或直接发送电子邮件至我们的销售团队[email protected]
      参考价格(美元)
      数量
      单价
      小计金额
      1
      US$25.68
      US$25.68
      5
      US$24.62
      US$123.10
      10
      US$23.68
      US$236.80
      25
      US$22.62
      US$565.50
      100
      US$20.22
      US$2 022.00
      250
      US$19.29
      US$4 822.50
      500
      US$18.36
      US$9 180.00
      由于2021年半导体供不应求,低于2021年之前的正常价格,请发询价确认。
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