DH8900CC S LJW2

DH8900CC S LJW2
Mfr. #:
DH8900CC S LJW2
制造商:
Intel
描述:
Chipsets 8900 Chipset Server FCBGA-942
生命周期:
制造商新产品。
数据表:
DH8900CC S LJW2 数据表
交货:
DHL FedEx Ups TNT EMS
支付:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
更多信息:
DH8900CC S LJW2 更多信息
产品属性
属性值
制造商:
英特尔
产品分类:
芯片组
RoHS:
Y
系列:
8900
产品:
服务器芯片组
芯片组系列:
8900
类型:
PCH
代码名称:
洞穴溪
嵌入式选项:
嵌入式
PCIe 修订版:
1.0
PCIe 配置:
4 Lanes
集成显卡:
无图形
USB端口数量:
6
SATA 端口数:
2
TDP - 最大值:
8.5 W
最高工作温度:
+ 103 C
包装/案例:
FCBGA-942
打包:
托盘
长度:
27 mm
宽度:
27 mm
品牌:
英特尔
安装方式:
贴片/贴片
CPU 配置 - 最大值:
2
湿气敏感:
是的
产品类别:
芯片组
出厂包装数量:
1
子类别:
芯片组
USB 版本:
2.0
第 # 部分别名:
923820
Tags
DH8900CCS, DH8900C, DH8900, DH890, DH89, DH8
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
Communication Chipset 942-Pin FC-BGA Tray
***ical
Communications Chip 942-Pin FCBGA Tray
*** Electronic Components
Chipsets 8900 Chipset Server FCBGA-942
Server Chipsets
Intel's Server Chipsets provides extensive I/O support with functions and capabilities that include PCI Express, PCI Local Bus, ACPI power management, enhanced DMA controller, Serial ATA, USB host interface, integrated 10/100/1000 Gigabit Ethernet MAC, and system management bus (SMBus) with additional support for I2C devices. These chipsets provide support for Intel High Definition Audio, Rapid Storage Technology, Active Management Technology, Virtualization Technology for Directed I/O, Trusted Execution Technology, Flexible Display Interconnect, Anti-Theft Technology, and JTAG Boundary Scan support.Learn More
89xx Communication Chipsets
Intel's 89xx Communication Chipsets are a platform controller hub (PCH) that includes standard PC interfaces (e.g., PCI Express, SATA, USB, etc.) along with Intel QuickAssist Technology and I/O interfaces. The PCH can be accessed by the IA processor via two interfaces: a DMI interface that provides connectivity to the standard PC interfaces and a PCI Express interface that provides connectivity to the PCH's PCI Express End Point (EP) for Intel QuickAssist Technology and access to the GbE MACs. These interfaces are not dependent on one another and can be used independently in a system.Learn More
型号 制造商 描述 库存 价格
DH8900CCS LJW2
DISTI # V99:2348_07313339
Intel CorporationPlatform Controller Hub Tray
RoHS: Compliant
1
  • 200:$43.3800
  • 50:$44.8000
  • 10:$46.3000
  • 1:$47.8900
DH8900CC S LJW2
DISTI # C1S325900208823
Intel CorporationCommunications Chipset Tray
RoHS: Compliant
1
  • 1:$47.8900
DH8900CC SLJW2
DISTI # DH8900CCS LJW2
Intel CorporationCommunication Chipset 942-Pin FC-BGA Tray - Trays (Alt: DH8900CCS LJW2)
RoHS: Compliant
Min Qty: 1
Container: Tray
Americas - 0
  • 1:$47.5900
  • 10:$46.9900
  • 25:$46.3900
  • 50:$45.7900
  • 100:$45.1900
  • 500:$44.5900
  • 1000:$43.9900
DH8900CC S LJW2
DISTI # 607-DH8900CCSLJW2
Intel CorporationChipsets 8900 Chipset Server FCBGA-942
RoHS: Compliant
7
  • 1:$49.2900
  • 10:$47.9400
  • 50:$46.6600
图片 型号 描述
904-27-1-23-2-B-0

Mfr.#: 904-27-1-23-2-B-0

OMO.#: OMO-904-27-1-23-2-B-0

Heat Sinks Chipset Heatsink with Clip, Elliptical, 27mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
904-27-2-23-2-B-0

Mfr.#: 904-27-2-23-2-B-0

OMO.#: OMO-904-27-2-23-2-B-0

Heat Sinks Chipset Heatsink with Clip, Pin Fin, 27mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
904-27-1-12-2-B-0

Mfr.#: 904-27-1-12-2-B-0

OMO.#: OMO-904-27-1-12-2-B-0

Heat Sinks Chipset Heatsink with Clip, Elliptical, 27mm Chip Size, 11.6mm Height, Aluminum, Black Anodized
904-27-2-12-2-B-0

Mfr.#: 904-27-2-12-2-B-0

OMO.#: OMO-904-27-2-12-2-B-0-WAKEFIELD

BOARD LEVEL HEAT SINK
904-27-1-12-2-B-0

Mfr.#: 904-27-1-12-2-B-0

OMO.#: OMO-904-27-1-12-2-B-0-WAKEFIELD

HEATSINK 27X27X12MM ELLIPTICAL
904-27-1-23-2-B-0

Mfr.#: 904-27-1-23-2-B-0

OMO.#: OMO-904-27-1-23-2-B-0-WAKEFIELD

Elliptical Fin Heat Sink
904-27-2-23-2-B-0

Mfr.#: 904-27-2-23-2-B-0

OMO.#: OMO-904-27-2-23-2-B-0-WAKEFIELD

BOARD LEVEL HEAT SINK
可用性
库存:
Available
订购:
1989
输入数量:
DH8900CC S LJW2的当前价格仅供参考,如果您想获得最优惠的价格,请提交查询或直接发送电子邮件至我们的销售团队[email protected]
参考价格(美元)
数量
单价
小计金额
1
US$49.29
US$49.29
10
US$47.94
US$479.40
50
US$46.66
US$2 333.00
200
US$45.45
US$9 090.00
由于2021年半导体供不应求,低于2021年之前的正常价格,请发询价确认。
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