ECB130ABDCN-Y3

ECB130ABDCN-Y3 Overview

This product is manufactured by Micron Technology. This device belongs to the SDRAM - LPDDR2 type. This product has a Data Bus Width of 32 bit. The 32 M x 32. Die package/case type is utilized by this product. Tray packaging for easy dispensing Micron is a trusted brand for quality electronics DRAM product type 1 of 100 Memory & Data Storage as subcategory

ECB130ABDCN-Y3 Image

ECB130ABDCN-Y3 Specifications

• Manufacturer: Micron Technology
• Product Category: DRAM
• RoHS: Y
• Type: SDRAM - LPDDR2
• Data Bus Width: 32 bit
• Organization: 32 M x 32
• Package / Case: Die
• Memory Size: 1 Gbit
• Series: ECB
• Packaging: Tray
• Brand: Micron
• Product Type: DRAM
• Factory Pack Quantity: 1
• Subcategory: Memory & Data Storage

ECB130ABDCN-Y3 FAQ

• A: At what frequency does the Manufacturer?

  Q: The product Manufacturer is Micron Technology.

• A: Is the cutoff frequency of the product Type?

  Q: Yes, the product's Type is indeed SDRAM - LPDDR2

• A: At what frequency does the Data Bus Width?

  Q: The product Data Bus Width is 32 bit.

• A: Is the cutoff frequency of the product Organization?

  Q: Yes, the product's Organization is indeed 32 M x 32

• A: What is the Package / Case of the product?

  Q: The Package / Case of the product is Die.

• A: At what frequency does the Packaging?

  Q: The product Packaging is Tray.

• A: At what frequency does the Brand?

  Q: The product Brand is Micron.

• A: Is the cutoff frequency of the product Product Type?

  Q: Yes, the product's Product Type is indeed DRAM

• A: What is the Factory Pack Quantity of the product?

  Q: The Factory Pack Quantity of the product is 1.

• A: At what frequency does the Subcategory?

  Q: The product Subcategory is Memory & Data Storage.