 | | | |
| PartNumber | DIP624-011BLF | DIP6 | DIP600-40P |
| Description | IC & Component Sockets 24C OPEN FRAME | ||
| Manufacturer | FCI / Amphenol | Amphenol FCI | - |
| Product Category | IC & Component Sockets | Sockets for ICs, Transistors | - |
| RoHS | E | - | - |
| Product | DIP / SIP Sockets | - | - |
| Packaging | Tube | Tube | - |
| Brand | Amphenol FCI | - | - |
| Product Type | IC & Component Sockets | - | - |
| Factory Pack Quantity | 1071 | - | - |
| Subcategory | IC & Component Sockets | - | - |
| Series | - | - | - |
| Type | - | DIP, 0.6" (15.24mm) Row Spacing | - |
| Termination | - | Solder | - |
| Operating Temperature | - | - | - |
| Mounting Type | - | Through Hole | - |
| Features | - | Open Frame | - |
| Housing Material | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
| Number of Positions or Pins Grid | - | 24 (2 x 12) | - |
| Pitch Mating | - | 0.100" (2.54mm) | - |
| Contact Finish Mating | - | Gold | - |
| Pitch Post | - | 0.100" (2.54mm) | - |
| Contact Finish Post | - | Tin | - |
| Contact Finish Thickness Mating | - | 10μin (0.25μm) | - |
| Contact Material Mating | - | Beryllium Copper | - |
| Contact Finish Thickness Post | - | 200μin (5.08μm) | - |
| Contact Material Post | - | Brass | - |