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| PartNumber | 28-5205-01 | 28-5205-00 | 28-526-10 |
| Description | IC & Component Sockets Textool QFN .5MM,8P EVEN ROW,W/THRML PIN | IC & Component Sockets Textool QFN .5MM,8P EVEN RW,W/O THRML PN | IC & Component Sockets 28 PIN W/HANDLE |
| Manufacturer | - | - | Aries Electronics |
| Product Category | - | - | IC Chips |
| Series | - | - | Lo-PRORfile, 526 |
| Type | - | - | DIP, ZIF (ZIP) |
| Packaging | - | - | Bulk |
| Termination | - | - | Solder |
| Operating Temperature | - | - | -55°C ~ 105°C |
| Mounting Type | - | - | Through Hole |
| Features | - | - | Closed Frame |
| Housing Material | - | - | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Number of Positions or Pins Grid | - | - | 28 (2 x 14) |
| Pitch Mating | - | - | 0.100" (2.54mm) |
| Contact Finish Mating | - | - | Tin |
| Pitch Post | - | - | 0.100" (2.54mm) |
| Contact Finish Post | - | - | Tin |
| Contact Finish Thickness Mating | - | - | 10μin (0.25μm) |
| Contact Material Mating | - | - | Beryllium Copper |
| Contact Finish Thickness Post | - | - | 10μin (0.25μm) |
| Contact Material Post | - | - | Beryllium Copper |