303M

303M vs 303M-11A1T0 vs 303M-05A6G0

 
PartNumber303M303M-11A1T0303M-05A6G0
DescriptionHeat Sinks Compact Heatsink for Dual Stud-Mounted Semiconductor Cases, 50.8x50.8x76.2mm, (1) 10-32UNF, 0.625 Inch Thread DepthINSTOCK
ManufacturerWakefield-Vette--
Product CategoryHeat Sinks--
RoHSY--
ProductHeat Sinks--
Mounting StyleThrough Hole--
Heatsink MaterialAluminum--
Fin StyleExtruded Axial Fin--
Length76.2 mm--
Width50.8 mm--
Height50.8 mm--
Designed forStud Mounted Semiconductor Cases--
ColorBlack--
Series303--
TypeBoard Level--
BrandWakefield-Vette--
Product TypeHeat Sinks--
Factory Pack Quantity50--
SubcategoryHeat Sinks--
制造商 型号 描述 RFQ
Wakefield-Vette
Wakefield-Vette
303M Heat Sinks Compact Heatsink for Dual Stud-Mounted Semiconductor Cases, 50.8x50.8x76.2mm, (1) 10-32UNF, 0.625 Inch Thread Depth
303MM Heat Sinks Compact Heat Sink for Dual StudMounted Semiconductor Cases
303M Heat Sinks Compact Heatsink for Dual Stud-Mounted Semiconductor Cases, 50.8x50.8x76.2mm, (1) 10-32UNF, 0.625 Inch Thread Depth
303M-11A1T0 全新原装
303M-11F1G0 全新原装
303M-12A3FE 全新原装
303MA 全新原装
303MHZ 全新原装
303ML902 全新原装
303M-05A6G0 INSTOCK
303M-11F1T0 11F1T0,BLK,TIN,300V,NO HC,FT,W/PKG
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