 | | | |
| PartNumber | 558-10-500M30-001104 | 558-10-504M29-001104 | 558-10-520M31-001104 |
| Description | BGA SURFACE MOUNT 1.27MM | BGA SURFACE MOUNT 1.27MM | BGA SURFACE MOUNT 1.27MM |
| Manufacturer | - | Preci-Dip | - |
| Product Category | - | Sockets for ICs, Transistors | - |
| Series | - | 558 | - |
| Type | - | BGA | - |
| Packaging | - | Bulk | - |
| Termination | - | Solder | - |
| Operating Temperature | - | -55°C ~ 125°C | - |
| Mounting Type | - | Surface Mount | - |
| Features | - | Closed Frame | - |
| Housing Material | - | FR4 Epoxy Glass | - |
| Number of Positions or Pins Grid | - | 504 (29 x 29) | - |
| Pitch Mating | - | 0.050" (1.27mm) | - |
| Contact Finish Mating | - | Gold | - |
| Pitch Post | - | 0.050" (1.27mm) | - |
| Contact Finish Post | - | Gold | - |
| Contact Finish Thickness Mating | - | 10μin (0.25μm) | - |
| Contact Material Mating | - | Brass | - |
| Contact Finish Thickness Post | - | 10μin (0.25μm) | - |
| Contact Material Post | - | Brass | - |
| 制造商 | 型号 | 描述 | RFQ |
|---|---|---|---|
Preci-Dip |
558-10-500M30-001104 | BGA SURFACE MOUNT 1.27MM | |
| 558-10-504M29-001104 | BGA SURFACE MOUNT 1.27MM | ||
| 558-10-520M31-001104 | BGA SURFACE MOUNT 1.27MM | ||
| 558-10-560M33-001104 | BGA SURFACE MOUNT 1.27MM | ||
| 558-10-576M30-001104 | BGA SURFACE MOUNT 1.27MM |