 | | | |
| PartNumber | B82498F3820G | B82498F3821J1 | B82498F3820J1 |
| Description | Ind Chip Molded Wirewound 82nH 2% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R (Alt: B82498F3820G000) | Ind Chip Molded Wirewound 820nH 5% 25MHz 23Q-Factor Ceramic 180mA 0805 Blister T/R - Tape and Reel (Alt: B82498F3821J1) | Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R - Tape and Reel (Alt: B82498F3820J1) |
| 制造商 | 型号 | 描述 | RFQ |
|---|---|---|---|
| B82498F3820G | Ind Chip Molded Wirewound 82nH 2% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R (Alt: B82498F3820G000) | ||
| B82498F3829K1 | Ind Chip Molded Wirewound 8.2nH 10% 250MHz 50Q-Factor Ceramic 700mA 0805 Blister T/R (Alt: B82498F3829K001) | ||
| B82498F3821J1 | Ind Chip Molded Wirewound 820nH 5% 25MHz 23Q-Factor Ceramic 180mA 0805 Blister T/R - Tape and Reel (Alt: B82498F3821J1) | ||
| B82498F3820J1 | Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R - Tape and Reel (Alt: B82498F3820J1) | ||
EPCOS / TDK |
B82498F3820J000 | FIXED IND 82NH 500MA 190 MOHM | |
| B82498F3821J000 | Inductor Chip Molded Wirewound 820nH 5% 25MHz 23Q-Factor Ceramic 180mA 1.9Ohm DCR 0805 Automotive Blister T/R | ||
| B82498F3829K000 | FIXED IND 8.2NH 700MA 90 MOHM | ||
| B82498F3820G000 | Fixed Inductors SMT-INDUCTOR 0805 82NH 2% | ||
| B82498F3820G001 | Fixed Inductors SMT-INDUCTOR 0805 82NH 2% | ||
| B82498F3821G001 | Fixed Inductors SMT-INDUCTOR 0805 820NH 2% | ||
| B82498F3820J001 | Fixed Inductors SMT-INDUCTOR 0805 82NH 5% | ||
| B82498F3829K001 | Fixed Inductors SMT-INDUCTOR 0805 8.2NH 10% | ||
| B82498F3821G000 | Fixed Inductors SMT-INDUCTOR 0805 820NH 2% | ||
| B82498F3821J001 | Fixed Inductors SMT-INDUCTOR 0805 820NH 5% | ||
| B82498F3821J | Fixed Inductors 820nH 180mA 5% 2.3x1.7mm SMD | ||
| B82498F3820J | Fixed Inductors 82nH 500mA 5% 2.3x1.7mm SMD | ||
| B82498F3829K | Fixed Inductors 8.2nH 700mA 10% 2.3x1.7mm SMD |